MEMS aka Microelectromechanical Systems is a technology that is essential most especially to the semiconductor industry; it is designed for tiny devices as it is made up of components that are between 1 and 100 micrometers in size. It has a lot of uses particularly electronics, biotechnology, as well as in communication industry.
MEMS production/fabrication is carried out by a number of different processes, which include deposition, pattering, and etching. However, in this content, we are to focus on the etching processes for MEMS.
There are several methods used in MEMS etching but they can be divided into two broad categories - the wet etching and the dry etching process.
Dry etching - the material is dissolved using reactive ions or a vapor phase etchant; one advantage of this process is that it is capable of defining small feature size less tha100 nm. It has several disadvantages as well, including: high cost, low throughput, poor selectivity, hard to implement, and the potential for radiation damage.
Sample of dry etching
Xenon fluoride etching - this dry vapor phase isotropic etch process was first utilized in 1995; it is mainly for the purpose of releasing metal and dielectric structures by undercutting silicon.
Plasma etching - a dry etching process that includes the generation of reactive species, the diffusion of these species, and then adsorption. (note: etch species is also known as plasma source)
Wet etching - the material is dissolved through immersion in a chemical solution inside a wet bench. It has a number of advantages, including: low cost, easy to implement, high etching rate, and good selectivity for most materials. However, it has several disadvantages as well such as the inadequacy for defining feature size that is less 1 micrometer.
Sample of wet etching
Isotropic etching - known as the non-directional removal of material from a substrate in a chemical process with the help of a substance/mixture called an etchant.
Hydrofluoric acid etching - this process uses an aqueous etchant for silicon dioxide.
There are quite a number of processes involved in etching - each has its own advantages and limitations. One thing is clear, however - etching plays a vital role in micro fabrication, which is essential to the production of devices needed in the industry.
MEMS production/fabrication is carried out by a number of different processes, which include deposition, pattering, and etching. However, in this content, we are to focus on the etching processes for MEMS.
There are several methods used in MEMS etching but they can be divided into two broad categories - the wet etching and the dry etching process.
Dry etching - the material is dissolved using reactive ions or a vapor phase etchant; one advantage of this process is that it is capable of defining small feature size less tha100 nm. It has several disadvantages as well, including: high cost, low throughput, poor selectivity, hard to implement, and the potential for radiation damage.
Sample of dry etching
Xenon fluoride etching - this dry vapor phase isotropic etch process was first utilized in 1995; it is mainly for the purpose of releasing metal and dielectric structures by undercutting silicon.
Plasma etching - a dry etching process that includes the generation of reactive species, the diffusion of these species, and then adsorption. (note: etch species is also known as plasma source)
Wet etching - the material is dissolved through immersion in a chemical solution inside a wet bench. It has a number of advantages, including: low cost, easy to implement, high etching rate, and good selectivity for most materials. However, it has several disadvantages as well such as the inadequacy for defining feature size that is less 1 micrometer.
Sample of wet etching
Isotropic etching - known as the non-directional removal of material from a substrate in a chemical process with the help of a substance/mixture called an etchant.
Hydrofluoric acid etching - this process uses an aqueous etchant for silicon dioxide.
There are quite a number of processes involved in etching - each has its own advantages and limitations. One thing is clear, however - etching plays a vital role in micro fabrication, which is essential to the production of devices needed in the industry.
About the Author:
Paul Drake has had several years of experience working in a high tech facility before venturing on the Internet as a content writer. He uses his prior knowledge in writing industry-related topics, including etching process for MEMS. He also manages a personal blog of the same niche.
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